Product
Product
WT5902-60-50 Thermal Pad
WT5902-60-50 Thermal Pad could solve the problem of product tolerance change. The high vertical heat conductivity could be good TIM (Thermal Interface Material) between Heat Source (CPU or electronic chipset) and cooling module. They are offered with a hard, metalized liner option for easy handling and improved rework.
FEATURES
l Thickness range: 0.5~0.99mm
l Low density: 3.5 g/cm³
l RoHS, REACH compliant
l Flammability rating: UL94-V0 compliant
l High thermal interface performance: 6 W/(m·K)
l Excellent flexibility: can be perfectly embed in uneven interface
l High applicability: correspond to −50 to 150 °C and maintains long-term reliability
APPLICATION
l High-Reliability electronic cooling and heating components, such as electronic devices, semiconductor memory devices, etc
l General-purpose inverter, Medical equipments, DSC
l Auto-electronic, such as Car-mounted camera, motor control unit, car navigation, automotive lighting (LED)
l Luminous source of laser HUD
l Microelectronic consumer and handheld electronic devices (such as mobile phones, computers, etc.)
l Base station, IGBT module
Click here to get more details
