Product
Product
WT5902-70-35 Thermal Pad
WT5902-70-35 Thermal pad can solve the problem of tolerance changes when design product structure, and can be reused. It is a good vertical thermal conduction material between the heat source (CPU or electronic chipset) and the heat sink. Easy to use and rework.
FEATURES
l Thickness range: 1.0~4.0mm
l Low density: 3.5 g/cm³
l RoHS, REACH compliant
l Flammability rating: UL94-V0 compliant
l High thermal interface performance: 7 W/(m·K)
l Excellent flexibility: can be perfectly embed in uneven interface
l High applicability: correspond to −50 to 150 °C and maintains long-term reliability
APPLICATION
l High-Reliability electronic cooling and heating components, such as electronic devices, semiconductor memory devices, etc
l General-purpose inverter, Medical equipments, DSC
l Auto-electronic, such as Car-mounted camera, motor control unit, car navigation, automotive lighting (LED)
l Luminous source of laser HUD
l Microelectronic consumer and handheld electronic devices (such as mobile phones, computers, etc.)
l Base station, IGBT module
