Product
Product
WT 5902-G50-40 Thermal Pad
WT5902-G50-40 Thermal pad can solve the problem of tolerance changes when design product structure, and can be reused. It is a good vertical thermal conduction material between the heat source (CPU or electronic chipset) and the heat sink. Easy to use and rework.
FEATURES
l Thickness range: 0.5~4.0mm
l Low density: 3.3 g/cm³
l High thermal interface performance: 5 W/(m·K)
l Excellent flexibility: can be perfectly embed in uneven interface
l High applicability: stable performance under -50~150℃
l Excellent flame retardant performance: meet UL94-V0 level
l Meet RoHS, REACH standard
APPLICATION
l High-Reliability electronic cooling and heating components, such as electronic devices, semiconductor memory devices, etc
l General-purpose inverter, Medical equipments, DSC
l Automotive electronics, such as on-board cameras, motor control units, automotive navigation, automotive lighting (LED)
l Laser HUD light source
l Consumer microelectronics and hand held electronic device (like mobile phone, computer, etc)
l Base station, IGBT module
