WT 5902-50-40 Thermal Pad

WT5902-50-40 Thermal pad can solve the problem of tolerance changes when design product structure, and can be reused. It is a good vertical thermal conduction material between the heat source (CPU or electronic chipset) and the heat sink. Easy to use and rework.

FEATURES

lThickness range: 1.0~5.0mm

lLow density: 3.3 g/cm³

lHigh thermal interface performance: 5 W/(m·K)

lExcellent flexibility: can be perfectly embed in uneven interface

lHigh applicability: stable performance under -50~150℃

lExcellent flame retardant performance: meet UL94-V0 level

lMeet RoHS, REACH standard

 

APPLICATION

 

lHigh-Reliability electronic cooling and heating components, such as electronic devices, semiconductor memory devices, etc

lGeneral-purpose inverter, Medical equipments, DSC

lAutomotive electronics, such as on-board cameras, motor control units, automotive navigation, automotive lighting (LED)

lLaser HUD light source

lConsumer microelectronics and hand held electronic device (like mobile phone, computer, etc)

lBase station, IGBT module

 

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