Product
Product
WT5921-32T
This product is a thermal gel made of silicone resin as the base material, with special particle size control and matching thermal conductive filler, interface treatment agent and dispersant added in a certain proportion, and processed by a special process.
In thermal management applications, it can provide excellent thermal conductivity with a minimum thickness of 0.02mm after being compressed. This product has good shear thinning properties and can form a uniform thin layer under pressure. It is mainly used for thermal conductivity at the interface of TIM1 chips and as a TIM2 between heat sinks and heat sources to provide heat transfer in small spaces.
