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WT 5902-D40-40 Thermal Pad

WT 5902-D40-40 Thermal Pad could solve the problem of product tolerance change.  The high vertical heat conductivity could be good TIM (Thermal Interface Material) between Heat Source (CPU or electronic chipset) and cooling module. They are offered with a hard, metalized liner option for easy handling and improved rework.

 

FEATURES AND BENEFITS

l Easy to apply and remove

l Fine electrical non-conductivity and mechanical property

l Close conformity to irregular or complex surface with good performance of ductility

l UL-94 V-0 Certified test for flame-retardancy

l One-sided adhesive

l Soft, low Hardness

 

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