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Product

 WT5902-70-35 Thermal Pad

  

WT5902-70-35 Thermal pad can solve the problem of tolerance changes when design product structure, and can be reused. It is a good vertical thermal conduction material between the heat source (CPU or electronic chipset) and the heat sink. Easy to use and rework.灰色.jpg

FEATURES

l Thickness range: 1.0~4.0mm

l Low density: 3.5 g/cm³

l RoHS, REACH compliant

l Flammability rating: UL94-V0 compliant

l High thermal interface performance: 7 W/(m·K)

l Excellent flexibility: can be perfectly embed in uneven interface

l High applicability: correspond to −50 to 150 °C and maintains long-term reliability

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APPLICATION

l Aerospace, military and auto-electronic cooling of heat generating components,, such as electronic parts, semiconductor memory devices, etc

l General-purpose inverter, Medical equipments, DSC

l Auto-electronic, such as Car-mounted camera, motor control unit, car navigation, automotive lighting (LED)

l Luminous source of laser HUD

l Microelectronic consumer and handheld electronic devices (such as mobile phones, computers, etc.)

l Base station, IGBT module

 

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