WT 5902-50-55A11  Thermal Pad

WT5902-50-55A11 Thermal pad can solve the problem of tolerance changes when design product structure, and can be reused. It is a good vertical thermal conduction material between the heat source (CPU or electronic chipset) and the heat sink. Easy to use and rework.

 

FEATURES

l Thickness range: 0.75~4.0mm

l Low  density: 3.3 g/cm³

l High thermal interface performance: 5W/(m·K)

l Excellent flexibility: can be perfectly embed in uneven interface

l High applicability: stable performance under -50~150℃

l Excellent flame retardant performance: meet UL94-V0 level

l Meet RoHS, REACH standard

 

APPLICATIONS

l Cooling Aerospace, Military and Automotive electronic heater elements, such as electron device, semiconductor storage device, etc.

l General-purpose inverter, Medical equipments, DSC

l Automotive electronics, such as on-board cameras, motor control units, automotive navigation, automotive lighting (LED)

l Laser HUD light source

l Consumer microelectronics and hand held electronic device (like mobile phone, computer, etc)

l Base station, IGBT module

 

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