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Product

 WT 5912-G30-40 Thermal Pad

 

WT 5912-G30-40 thermal pad is mainly used in the application scene for the air gap between internal wafer and heat sink sheet of the shockable handheld, wearable, mobile terminal products; it can also be applied to the housing of some electronic products, so that it with the function of heat dissipation, Insulation, dust and water resistance. It has the characteristics of low oil leakage, excellent interfacial filling and repeated use.

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FEATURES

l Thickness range: 0.5~4.0mm

l Low density: 3.2g/cm³

l High thermal interface performance: 3W/(m·K)

l Excellent flexibility: can be perfectly embed in uneven interface

l High applicability: stable performance under -50~150℃

l Excellent flame retardant performance: meet UL94-V0 level

l Meet RoHS, REACH standard

APPLICATION

Power supply equipment

Vehicle electronics

Communication equipment

Network terminal

Storage device

 

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