Product
Product
WT 5912-20-33 Thermal Pad
WT 5912-20-33 Thermal Pad is mainly used between the internal chip and radiator of handheld, wearable, and mobile terminal products that are vibrating; and it also can apply in electronic products housing for Heat conduction, Insulation, dust-proof and waterproof function. It has the characteristics of low oil leakage, better interface filling, and can be used repeatedly.
FEATURES
l Thickness range: 1.0~4.0mm
l Low density: 2.9 g/cm³
l High thermal interface performance: 2 W/(m·K)
l Excellent flexibility: can be perfectly embed in uneven interface
l High applicability: stable performance under -50~150℃
l Excellent flame retardant performance: meet UL94-V0 level
l Meet RoHS, REACH standard
APPLICATION
l Power supply equipment
l Vehicle electronics
l Communication equipment
l Network terminal
l Storage device
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