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Product

 

WT 5902-50-40 Thermal Pad

WT5902-50-40 Thermal pad can solve the problem of tolerance changes when design product structure, and can be reused. It is a good vertical thermal conduction material between the heat source (CPU or electronic chipset) and the heat sink. Easy to use and rework.

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FEATURES

Thickness range: 1.0~5.0mm

Low density: 3.3 g/cm³

High thermal interface performance: 5 W/(m·K)

Excellent flexibility: can be perfectly embed in uneven interface

High applicability: stable performance under -50~150℃

Excellent flame retardant performance: meet UL94-V0 level

Meet RoHS, REACH standard

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APPLICATION

 

Cooling Aerospace, Military and Automotive electronic heater elements, such as electron device, semiconductor storage device, etc.

General-purpose inverter, Medical equipments, DSC

Automotive electronics, such as on-board cameras, motor control units, automotive navigation, automotive lighting (LED)

Laser HUD light source

Consumer microelectronics and hand held electronic device (like mobile phone, computer, etc)

Base station, IGBT module

 

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