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Product

 WT 5912-30-29 Thermal Pad

WT5912-30-29 Thermal Pad is mainly used in more application scenarios: traditional filling in moving, wearable and mobility devices; and it also can apply in electronic products housing for Heat conduction, Insulation, dust-proof and waterproof function.

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FEATURES

l Thickness range: 1.0~4.0mm

l Low density: 3.2g/cm³

l High thermal interface performance: 3W/(m·K)

l Excellent flexibility: can be perfectly embed in uneven interface

l High applicability: stable performance under -50~150℃

l Excellent flame retardant performance: meet UL94-V0 level

l Meet RoHS, REACH standard

APPLICATION

Power supply equipment

Vehicle electronics

Communication equipment

Network terminal

Storage device

 

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