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Why do carbon fiber thermal pads become the newest in thermal interface materials?

 

The functions of electronic products are getting more and more advanced. While improving the user experience, they have also put forward more stringent requirements on thermal conduction and heat dissipation systems. Many manufacturers have sought materials with higher thermal conductivity. Carbon fiber thermal pad has gradually entered the public view. What kind of material is this? Why is it so highly regarded?

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Carbon fiber thermal pad is a type of thermal pad with thermal carbon fiber as the main raw material. It is used between the heating element and the heat sink. By filling the gap between them to accelerate the heat transfer of the electronic equipment to ensure the performance and life of electronics. Thermal carbon fiber is a highly thermally conductive carbon fiber material. The thermal conductivity in the fiber direction can exceed copper. At the same time, it has good mechanical properties and excellent thermal and radiation heat dissipation capabilities. The fibrous high thermal conductivity carbon powder made of this carbon fiber itself can be designed with thermally conductive orientation, which is the biggest difference and advantage from previous thermal materials.
The biggest difficulty in improving the heat conduction and heat dissipation system is to improve its heat conduction and heat dissipation efficiency. Waermtimo combines the advantages of independent research and development production plants, a number of national technology patents, etc., the exclusive debut of the WT series carbon fiber thermal pads, which have extremely high thermal conductivity in the vertical direction. According to the thickness of different pads, the thermal conductivity is extremely high , Respectively up to 15/18/25/28 W / (m · K).
Compared with the commonly used thermal pad on the market today, the WT series carbon fiber thermal pads have huge breakthroughs in several key parameters such as thermal resistance, thermal conductivity, ease of use, flame retardancy and service life. Cooling system for portable electronic equipment, such as 5G mobile phones, 3D glasses and other products.
5G mobile phones are undoubtedly the electronic products with the highest attention at present. It is not simply a matter of replacing 4G mobile phones with 5G chips, but redesigning the structure, heat dissipation, and antenna systems. 5G networks have ultra-high network bandwidth, which consumes more power during peak downloads. Compared with traditional 4G mobile phones, data power consumption increases by more than 50%, or even reaches 100%. Ordinary heat dissipation solutions cannot cope with such high heat. Although 5G mobile phones use highly integrated components as much as possible, the total number of components has still increased by more than 500, and the PCB area has also increased by about 20%. Adding so many components in the increasingly thinner internal space, its One can imagine the difficulty of heat dissipation. Therefore, the advent of carbon fiber thermal pads with ultra-high thermal conductivity will undoubtedly greatly improve the performance of 5G mobile phones, and provide a good thermal conduction environment for its update iterations.

 

Carbon fiber thermal pad because of its ultra-high thermal conductivity, light weight, corrosion resistance, high modulus, low density, oxidation resistance, non-oxidation environment resistance to ultra-high temperature, can be used repeatedly, no silicone oil precipitation, dry non-sticky, easy to apply and other characteristics, suitable for various types of equipment components with high heat density and high dimensional accuracy requirements, is an irreplaceable important heat dissipation system component. It has a subversive role in reducing the production costs of cutting-edge equipment and promoting the technological innovation of high-tech electronic products. The WT series of cost-effective carbon fiber thermal pads will quickly occupy the mainstream market, and will certainly become a newcomer in the field of thermal materials.

 

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